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2025-10-31 2
Precision PCB Manufacturing: Preventing Ion Migration with Advanced Technology
Precision PCB Manufacturing: Preventing Ion Migration with Advanced Technology In the world of PCB manufacturing, some design rules are born from hard-earned experience rather than just theoretical calculations. One such critical rule is maintaining a minimum 0.4mm hole-to-hole spacing - a specification that separates temporary prototypes from reliable production-ready boards. Ion Migration: The H...
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2025-10-21 28
Shuoqiang Electronics Paves the Way at the HK Electronics Fair: Driving the Future of FR4 PCB Manufacturing
Shuoqiang Electronics Paves the Way at the HK Electronics Fair: Driving the Future of FR4 PCB Manufacturing In the dynamic and ever-evolving landscape of global electronics, the Hong Kong Electronics Fair stands as a beacon of innovation and opportunity. As one of the world's most anticipated and prestigious trade shows for the electronics industry, it serves as a critical nexus for international...
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2025-09-18 69
The Foundation of Reliability: The Critical Role of PCB Insulation in Electronic Systems
The Foundation of Reliability: The Critical Role of PCB Insulation in Electronic Systems Introduction: Why PCB Insulation Defines Reliability Electronic systems have evolved dramatically over the last five decades, driven by the relentless demand for higher performance, miniaturization, and long-term reliability. In this landscape, PCB insulation plays a foundational role. It is more than just a p...
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2025-09-12 77
What are the Advantages of Reserved Process Edges in Streamlining PCB Production
Introduction and Detailed Explanation of Reserved Process Edges Introduction: The Unseen Enabler in Modern PCB Fabrication In the increasingly competitive landscape of printed circuit board (PCB) manufacturing, engineers constantly look for subtle but effective ways to improve production yield, consistency, and mechanical integrity. One such “quiet hero” is the practice of adding Reserved Process...
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2025-08-09 108
PCB Copper Plating Lines: Manual, Gantry, and Vertical Continuous Systems
PCB Copper Plating Lines Introduction In PCB manufacturing process, copper electroplating is a critical process for building conductive layers and ensuring the durability of the circuit. The efficiency, precision, and stability of this step largely depend on the type of electroplating line used. Today’s factories typically adopt one of three main systems: Manual Copper Plating Lines Gantry (Hoist-...
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2025-08-07 176
Understanding 2OZ Copper Thickness: IPC Standard vs. Real-World Practice
         When customers request a “2OZ copper thickness” for their PCBs, it seems like a straightforward specification. After all, 2OZ copper equates to 70μm in theory. But here's where it gets tricky—once the PCB Manufacturer is manufactured and cross-sectioned, the measured copper thickness often shows just around 60μm, sometimes even lower. This discrepancy frequently causes misunderstandings a...
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2025-02-16 244
PCB Plating Process
PCB Plating Process: Understanding Electroplating in Circuit Board Manufacturing Introduction The PCB plating process, specifically electroplating, is an essential step in printed circuit board (PCB) manufacturing. It enhances the board's conductivity, reliability, and durability by depositing a thin layer of metal, typically copper, onto the PCB surface and through drilled holes. This ensures str...
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2025-02-14 191
PCB Drilling Speed: The High-Speed Precision of PCB Drilling Machines, Spindle Speed & Drilling Rate
PCB Drilling Speed: The High-Speed Precision of PCB Drilling Machines, Spindle Speed & Drilling Rate Introduction In PCB (Printed Circuit Board) manufacturing, drilling is one of the most high-speed and precision-intensive processes. Modern mechanical and laser drilling machines operate at staggering speeds, ensuring efficient and precise hole creation for vias, through-holes, and microvias. W...
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2025-02-14 212
Key Parameters in the PCB Lamination Process In PCB Manufacturing
Key Parameters in the PCB Lamination Process In PCB Manufacturing Introduction The lamination process is a critical step in PCB (Printed Circuit Board) manufacturing, where multiple layers are bonded together under heat and pressure to form a multilayer PCB. Proper control of key lamination parameters ensures reliable adhesion, dimensional stability, and defect-free boards. The three most importan...
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2025-02-13 216
PCB Lamination Process: Key Techniques and Best Practices In PCB Manufacturing
PCB Lamination Process: Key Techniques and Best Practices In PCB Manufacturing Introduction Lamination is a critical process in PCB (Printed Circuit Board) manufacturing, where multiple layers of copper and dielectric materials are bonded together under high temperature and pressure to form a multilayer PCB. The lamination process ensures electrical insulation, mechanical strength, and structural...
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2025-02-13 222
Kraft Paper Role in the Lamination Process in PCB Manufacturing 
Kraft Paper Role in the Lamination Process in PCB Manufacturing Introduction Kraft paper plays a crucial role in PCB lamination, serving as a thermal and pressure buffer to ensure uniform heating, controlled cooling, and even pressure distribution. It helps to minimize defects, such as warping, delamination, and pressure-induced indentations, which can significantly affect PCB quality. Despite rec...
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2025-02-13 183
Preventing PCB Warping and Bowing During the Lamination Process In PCB Manufacturing
Preventing PCB Warping and Bowing During the Lamination Process Introduction PCB warping and bowing are common issues that arise during the lamination process, primarily due to thermal expansion mismatches, resin shrinkage, and internal stress accumulation. During lamination, prepreg (PP), inner layer cores, and copper foil are bonded together at high temperatures (130°C–170°C). As the resin flows...
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