PCB Manufacturing - PCB Board | PCB Manufacturing in China

2025-09-12 13

What are the Advantages of Reserved Process Edges in Streamlining PCB Production

Introduction and Detailed Explanation of Reserved Process Edges Introduction: The Unseen Enabler in Modern PCB Fabrication In the increasingly competitive landscape of printed circuit board (PCB) manufacturing, engineers constantly look for subtle but effective ways to improve production yield, consistency, and mechanical integrity. One such “quiet hero” is the practice of adding Reserved Process...

2025-08-09 40

PCB Copper Plating Lines: Manual, Gantry, and Vertical Continuous Systems

PCB Copper Plating Lines Introduction In PCB manufacturing process, copper electroplating is a critical process for building conductive layers and ensuring the durability of the circuit. The efficiency, precision, and stability of this step largely depend on the type of electroplating line used. Today’s factories typically adopt one of three main systems: Manual Copper Plating Lines Gantry (Hoist-...

2025-08-07 101

Understanding 2OZ Copper Thickness: IPC Standard vs. Real-World Practice

When customers request a “2OZ copper thickness” for their PCBs, it seems like a straightforward specification. After all, 2OZ copper equates to 70μm in theory. But here's where it gets tricky—once the PCB Manufacturer is manufactured and cross-sectioned, the measured copper thickness often shows just around 60μm, sometimes even lower. This discrepancy frequently causes misunderstandings a...

2025-02-16 169

PCB Plating Process

PCB Plating Process: Understanding Electroplating in Circuit Board Manufacturing Introduction The PCB plating process, specifically electroplating, is an essential step in printed circuit board (PCB) manufacturing. It enhances the board's conductivity, reliability, and durability by depositing a thin layer of metal, typically copper, onto the PCB surface and through drilled holes. This ensures str...

2025-02-14 124

PCB Drilling Speed: The High-Speed Precision of PCB Drilling Machines, Spindle Speed & Drilling Rate

PCB Drilling Speed: The High-Speed Precision of PCB Drilling Machines, Spindle Speed & Drilling Rate Introduction In PCB (Printed Circuit Board) manufacturing, drilling is one of the most high-speed and precision-intensive processes. Modern mechanical and laser drilling machines operate at staggering speeds, ensuring efficient and precise hole creation for vias, through-holes, and microvias. W...

2025-02-14 147

Key Parameters in the PCB Lamination Process In PCB Manufacturing

Key Parameters in the PCB Lamination Process In PCB Manufacturing Introduction The lamination process is a critical step in PCB (Printed Circuit Board) manufacturing, where multiple layers are bonded together under heat and pressure to form a multilayer PCB. Proper control of key lamination parameters ensures reliable adhesion, dimensional stability, and defect-free boards. The three most importan...

2025-02-13 139

PCB Lamination Process: Key Techniques and Best Practices In PCB Manufacturing

PCB Lamination Process: Key Techniques and Best Practices In PCB Manufacturing Introduction Lamination is a critical process in PCB (Printed Circuit Board) manufacturing, where multiple layers of copper and dielectric materials are bonded together under high temperature and pressure to form a multilayer PCB. The lamination process ensures electrical insulation, mechanical strength, and structural...

2025-02-13 145

Kraft Paper Role in the Lamination Process in PCB Manufacturing

Kraft Paper Role in the Lamination Process in PCB Manufacturing Introduction Kraft paper plays a crucial role in PCB lamination, serving as a thermal and pressure buffer to ensure uniform heating, controlled cooling, and even pressure distribution. It helps to minimize defects, such as warping, delamination, and pressure-induced indentations, which can significantly affect PCB quality. Despite rec...

2025-02-13 112

Preventing PCB Warping and Bowing During the Lamination Process In PCB Manufacturing

Preventing PCB Warping and Bowing During the Lamination Process Introduction PCB warping and bowing are common issues that arise during the lamination process, primarily due to thermal expansion mismatches, resin shrinkage, and internal stress accumulation. During lamination, prepreg (PP), inner layer cores, and copper foil are bonded together at high temperatures (130°C–170°C). As the resin flows...

2025-02-13 124

Optimized Prepreg Usage Techniques in PCB Lamination In PCB Manufacturing

Optimized Prepreg Usage Techniques in PCB Lamination Introduction Prepreg (PP) is a key material in PCB lamination, acting as the bonding and insulating layer between copper and core materials. Selecting and using PP correctly is crucial for ensuring mechanical stability, impedance control, and manufacturing efficiency. Improper use of PP can lead to delamination, warpage, uneven thickness, and el...

2025-02-13 258

Prepreg Types and Selection Techniques in PCB Manufacturing

Prepreg Types and Selection Techniques in PCB Manufacturing Prepreg Types: Prepreg (PP) is a key dielectric material used in PCB (Printed Circuit Board) lamination, serving as an insulating and bonding layer between copper foils and core substrates. Choosing the right prepreg type is critical for achieving reliable electrical performance, mechanical strength, and thermal stability in multilayer PC...

2025-02-13 95

Stack Up Before Lamination in PCB Manufacturing

Stack Up in PCB Manufacturing Introduction Stack up is a critical stage in multilayer PCB (printed circuit board) manufacturing where the individual inner layers are carefully stacked and prepared for the lamination process. This step ensures that the layers are properly aligned, free from contamination, and securely positioned to achieve a high-quality laminated structure. As PCB designs become m...

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