Introduction

            With the rapid development of RF (Radio Frequency), microwave, and high-speed digital applications, choosing the right PCB material is crucial for ensuring signal integrity, thermal management, and overall circuit performance. Rogers 4450F is a high-performance thermoset prepreg material designed specifically for multilayer RF/microwave circuits, offering exceptional dielectric properties, low loss, and excellent processability. Compared to the materials used by easy PCB, this material will be much more expensive

           In this article, we will explore the features, advantages, manufacturing considerations, and key applications of Rogers 4450F PCB material, helping engineers and designers optimize their high-frequency PCB designs.

What is Rogers 4450F?

Rogers 4450F is a thermoset hydrocarbon ceramic prepreg used for bonding multilayer PCBs, especially those requiring low dielectric loss and high thermal stability. It is part of the Rogers RO4000® series, known for its high-frequency performance and superior mechanical properties compared to traditional FR-4 materials.

Key Properties of Rogers 4450F

Property	Value	Importance
Dielectric Constant (Dk)	~3.52 at 10 GHz	Stable signal integrity in RF circuits
Dissipation Factor (Df)	~0.004 at 10 GHz	Low signal loss, ideal for high-frequency applications
Thermal Conductivity	0.6 W/mK	Efficient heat dissipation for power circuits
Glass Transition Temperature (Tg)	>280°C	High thermal stability for soldering and reflow processes
CTE (Coefficient of Thermal Expansion)	50 ppm/°C	Reliable multilayer PCB performance under thermal cycling

Rogers 4450F is commonly used in combination with RO4003C and RO4350B core materials, enabling designers to build high-layer count PCBs with excellent RF performance.

Note: Rogers 4450F is a prepreg (a semi-cured material) and does not include a core such as Rogers 4450F chips. Similarly, there are no specific prepregs available for RO4003C and RO4350B chips.

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Datasheet of 4450F

Why Choose Rogers 4450F for PCB Design?

1. Low Dielectric Loss for High-Frequency Performance

✔ The low dissipation factor (Df = 0.004) ensures minimal signal attenuation, making it ideal for high-frequency circuits and mmWave applications.
✔ Provides consistent electrical performance across a wide frequency range, crucial for 5G, satellite communication, and radar systems.

2. Excellent Thermal Stability

✔ High Tg (>280°C) and low CTE allow Rogers 4450F to withstand high soldering temperatures, preventing delamination and thermal degradation.
✔ Superior thermal conductivity (0.6 W/mK) improves heat dissipation, reducing hotspots in power-intensive applications.

3. Compatibility with Standard PCB Fabrication Processes

✔ Unlike PTFE-based laminates, Rogers 4450F can be processed using standard FR-4 PCB manufacturing techniques, reducing fabrication costs.
✔ Compatible with automated assembly and lead-free soldering, ensuring seamless production.

4. Mechanical Durability and Layer Adhesion

✔ Offers better layer bonding and stability than PTFE materials, improving reliability in multilayer designs.
✔ Provides consistent thickness control, reducing impedance variations in complex RF circuits.

5. Cost-Effective Alternative to PTFE-Based Materials

✔ While PTFE-based laminates offer excellent RF performance, they require specialized processing techniques.
✔ Rogers 4450F provides a balance between cost, performance, and manufacturability, making it a preferred choice for cost-sensitive high-frequency applications.

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Manufacturing Considerations for Rogers 4450F PCBs

To ensure optimal performance when working with Rogers 4450F, PCB designers and manufacturers must follow specific fabrication guidelines.

1. Layer Stack-Up Design

Rogers 4450F is commonly used as a prepreg bonding material in multilayer RF/microwave PCBs.

Typical stack-up involves Rogers 4003C or Rogers 4350B core layers, with 4450F bonding layers in between.

Precise dielectric thickness selection ensures proper impedance matching and signal transmission efficiency.

2. Drilling and Hole Preparation

Mechanical drilling is suitable for Rogers 4450F, but care must be taken to avoid burr formation.

Plasma treatment or desmearing processes may be required to ensure proper via plating adhesion.

3. Copper Foil Selection

Rogers 4450F supports various copper finishes, including ED (Electrodeposited) and rolled copper foils.

Low-profile copper foils minimize signal loss and improve high-frequency performance.

4. Lamination Process

Rogers 4450F requires controlled lamination pressure and temperature to ensure strong adhesion between layers.

Typical lamination conditions include:

Temperature: 190–220°C

Pressure: 250–400 psi

Curing Time: 60–90 minutes

Note: Rogers 4450F requires a lamination temperature range of 190–220°C. Common PCB factories use cyclic thermal oil heating press machines, where the oil temperature typically ranges from 220–230°C. The normal lamination process cannot reach 190-220°C, and it is essential to increase the thermal oil temperature to about 250°C or use electric-heated laminators to achieve the proper curing temperature. Otherwise, the material may cause board warping, delamination, and reduced strength.

5. Surface Finishing and Solder Mask Application

ENIG (Electroless Nickel Immersion Gold) is recommended for RF circuits due to its flat surface and oxidation resistance.

OSP (Organic Solderability Preservatives) is another cost-effective option.

Avoid thick solder mask coatings in RF designs, as they may impact impedance control.

6. Layer Lamination Scheme Comparison

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Applications of Rogers 4450F PCBs

Rogers 4450F is widely used in high-frequency, high-power, and high-reliability applications across various industries.

1. 5G and Wireless Communication Systems

✔ Used in 5G antennas, base stations, and RF power amplifiers.
✔ Enables low-loss signal transmission in high-frequency mmWave applications.

2. Aerospace and Satellite Communication

✔ Ideal for radar systems, satellite transceivers, and avionics PCBs.
✔ Provides high thermal stability and radiation resistance.

3. Automotive Radar and Advanced Driver Assistance Systems (ADAS)

✔ Found in 77 GHz automotive radar modules for collision avoidance and lane detection.
✔ Ensures consistent RF performance in extreme temperatures.

4. Military and Defense Electronics

✔ Used in secure communication systems, missile guidance, and electronic warfare devices.
✔ Provides low-loss, high-frequency performance under extreme conditions.

5. Industrial and IoT Applications

✔ Supports industrial sensors, IoT connectivity modules, and smart grid communication.
✔ Enhances energy efficiency and reliability in remote monitoring applications.

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Challenges in Manufacturing Rogers-4450F PCBs

Despite its advantages, working with Rogers 4450F presents some manufacturing challenges:

❌ Precise Lamination Control Required – Incorrect bonding pressure or temperature can result in delamination issues.
❌ Limited Availability – Rogers-4450F materials are more expensive and harder to source compared to standard FR-4.
❌ Strict Impedance Matching Needed – Designers must carefully calculate trace width and dielectric thickness to maintain signal integrity.
❌ Pay more attention to the breakdown-voltage – Designers must Pay more attention to the breakdown-voltage

By partnering with an experienced high-frequency PCB manufacturer, these challenges can be mitigated for optimal performance and cost efficiency.

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Conclusion

Rogers-4450F is a high-performance PCB prepreg material designed for RF, microwave, and high-speed digital applications. Its low dielectric loss, excellent thermal stability, and strong mechanical properties make it an ideal choice for 5G networks, aerospace, automotive radar, and defense electronics.

For high-quality Rogers-4450F PCB manufacturing, Shuoqiang Electronics provides custom multilayer PCB solutions, precision impedance control, and expert fabrication services. Contact us today to optimize your high-frequency PCB design!

FAQ

Q: Can RO4003C be used directly as a prepreg?
A: This is not feasible. RO4003C is a fully cured core material, lacking the flowability and bonding properties required for prepregs.

Q: Can RO4350B be paired with PTFE prepregs (e.g., RO3000 series)?
A: Not recommended. PTFE and the RO4000 series have significantly different thermal expansion coefficients, which can lead to delamination.

Q: Can RO4350B be used directly as a prepreg?
A: This is not possible. Like RO4003C, RO4350B is a cured core material and lacks the necessary flow and bonding characteristics of a prepreg.

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