Rogers RO4350B is a hydrocarbon ceramic-filled laminate widely used for RF, microwave, antenna, radar, and other high-frequency PCB applications.
Compared with standard FR-4, Rogers 4350B offers:
One major advantage of RO4350B is that it can be processed with many conventional PCB fabrication methods, making it easier to manufacture than some PTFE-based high-frequency materials.
This guide summarizes the main Rogers 4350B datasheet properties, typical applications, PCB manufacturing considerations, and differences compared with common FR-4 materials.

Rogers 4350B Datasheet and Key Properties
The following values are commonly referenced when evaluating Rogers RO4350B for PCB applications.
| Property | Rogers RO4350B |
|---|---|
| Material Type | Hydrocarbon ceramic-filled laminate |
| Dielectric Constant (Dk, 10 GHz) | 3.48 |
| Dissipation Factor (Df, 10 GHz) | 0.0037 |
| Tg | >280°C |
| Thermal Decomposition Temperature (Td) | >400°C |
| Z-Axis CTE | Approx. 30 ppm/°C |
| Moisture Absorption | ≤0.1% |
| Thermal Conductivity | Approx. 0.6 W/m·K |
| Main Applications | RF, microwave, antenna, radar, 5G, automotive RF |
For actual PCB design, designers should always confirm the required laminate thickness, copper thickness, dielectric constant used for impedance calculation, and material specification before releasing the final stack-up.
The main reason is simple:
High-frequency signals are much more sensitive to PCB material properties than ordinary low-frequency circuits.
As frequency increases, important parameters include:
Standard FR-4 performs very well for many electronic products, but its dielectric loss is higher and its electrical properties are generally less stable for demanding RF and microwave applications.
RO4350B is designed specifically for these applications.
Rogers 4350B has a dissipation factor of approximately 0.0037 at 10 GHz.
Lower Df means less signal energy is converted into heat during transmission.
This is especially important for:
For long transmission paths or higher operating frequencies, lower-loss material can significantly improve signal performance.
The dielectric constant of Rogers 4350B is approximately 3.48 at 10 GHz according to commonly referenced datasheet values.
Stable dielectric properties help engineers achieve more predictable:
This is particularly important in designs involving:
High-frequency PCB materials may also experience significant thermal stress during manufacturing and operation.
Rogers 4350B provides high thermal stability, with:
These properties help reduce risks associated with:
This makes the material suitable for applications requiring both RF performance and long-term reliability.
Moisture can affect electrical properties, especially in high-frequency circuits.
Rogers 4350B has low moisture absorption, approximately 0.1% or less.
This helps maintain stable performance in applications such as:
Low moisture absorption is particularly useful when the PCB must operate reliably in changing environmental conditions.
Rogers 4350B provides thermal conductivity of approximately 0.6 W/m·K, higher than typical standard FR-4.
This does not make it a replacement for:
but it can provide better thermal performance than ordinary FR-4 while still maintaining excellent RF characteristics.
Typical applications include:
RO4350B is mainly selected when electrical performance at higher frequencies becomes more important than basic material cost.
Common applications include:
Its low-loss characteristics help reduce transmission loss and maintain stable impedance.
Rogers 4350B is commonly considered for:
As operating frequency increases, material selection becomes increasingly important.
Automotive radar systems require reliable high-frequency performance.
RO4350B may be used in:
Stable dielectric properties help support predictable RF behavior.
Typical applications include:
These applications often require both electrical performance and environmental reliability.
Although RO4350B is mainly known as an RF and microwave laminate, it may also be used where very low signal loss is required.
Examples include:
However, material selection should always be based on the actual signal requirements rather than choosing Rogers material simply because it is considered a “high-performance” laminate.
| Property | Rogers RO4350B | Standard FR-4 |
|---|---|---|
| High-Frequency Performance | Excellent | General |
| Dielectric Loss | Low | Higher |
| Dk Stability | Better | More variable |
| Thermal Stability | High | Moderate |
| Material Cost | Higher | Lower |
| Manufacturing Difficulty | Moderate | Low |
| Typical Application | RF / Microwave | General Electronics |
The main difference is not that Rogers 4350B is simply a “better FR-4.”
They are designed for different requirements.
For many ordinary products, FR-4 remains the better choice because it provides excellent:
RO4350B becomes valuable when RF performance justifies the additional material and manufacturing cost.
Both materials are high-performance PCB laminates, but they target different applications.
| Property | Rogers RO4350B | Isola 370HR |
|---|---|---|
| Main Strength | RF / Microwave | High-Reliability FR-4 |
| Dk | Approx. 3.48 | Approx. 4.04 |
| Df | Approx. 0.0037 | Approx. 0.020 |
| Tg | >280°C | Approx. 180°C |
| Typical Application | RF, antenna, radar | Multilayer industrial PCB |
| Relative Cost | Higher | Lower |
Isola 370HR is often suitable for:
Rogers 4350B is more suitable when RF performance and low dielectric loss are the primary design requirements.
Selecting the correct laminate is only the first step.
PCB manufacturing also has a significant impact on final RF performance.
RO4350B is available in different laminate thicknesses.
Material thickness directly influences:
The PCB stack-up should therefore be confirmed before production.
Copper thickness affects:
Common PCB copper specifications may include:
For high-frequency circuits, thicker copper is not automatically better because trace geometry and sidewall characteristics also affect impedance.
Rogers PCBs frequently require controlled impedance.
Important factors include:
The PCB manufacturer should calculate and confirm the production stack-up before fabrication.
RO4350B is more compatible with conventional mechanical PCB processing than many PTFE-based laminates.
However, drilling quality still matters.
Poor drilling can affect:
For RF designs, even small manufacturing variations may influence electrical performance.
RO4350B can be used in multilayer PCB structures.
It can also be combined with FR-4 or other materials in a hybrid stack-up.
A hybrid design can help balance:
For example, only the RF layers may require Rogers material while other layers use FR-4.
This can significantly reduce material cost compared with using Rogers material throughout the entire PCB.
Using RO4350B for every layer may not always be necessary.
A hybrid PCB can use:
Rogers material
for RF signal layers
and:
FR-4
for control, power, or lower-frequency circuit layers.
This approach can provide:
However, hybrid stack-ups require careful control of:
Engineering review before production is recommended.
Not for every application.
RO4350B is better when low loss and stable high-frequency performance are required.
For ordinary electronics, FR-4 is usually more economical.
Yes.
Hybrid Rogers/FR-4 multilayer PCB structures are common when only some layers require RF performance.
No.
RO4350B is a hydrocarbon ceramic-filled laminate.
This is one reason its PCB manufacturing process is generally more compatible with conventional fabrication methods than many PTFE-based materials.
Yes, it is commonly considered for high-frequency communication, antenna, and RF applications where low loss and stable dielectric properties are important.
Not every design requires it, but many RO4350B applications involve RF transmission lines and therefore require impedance control.
For faster engineering review and quotation, provide:
If no final stack-up is available, the Rogers PCB Manufacturer can normally help review the design and recommend a manufacturable structure.
Rogers 4350B can provide excellent electrical performance, but material selection alone does not guarantee a good RF PCB.
Final performance also depends on:
From a PCB manufacturing perspective, the best material is not always the most expensive one.
The correct material is the one that meets:
Electrical performance + Reliability + Manufacturability + Cost
For some projects, RO4350B is the correct choice.
For others, high-Tg FR-4 or a hybrid Rogers/FR-4 structure may provide better overall value.
Rogers RO4350B is a widely used high-frequency PCB material offering:
It is particularly suitable for:
The key to a reliable Rogers PCB is not only choosing the correct laminate.
It also requires proper stack-up design, impedance control, material handling, lamination, drilling, and PCB manufacturing process control.
For high-frequency PCB projects, engineers should evaluate both electrical requirements and manufacturing capability before finalizing the material and stack-up.
A commonly referenced datasheet value is approximately 3.48 at 10 GHz. Designers should confirm which Dk value is required for their specific impedance calculation method.
The commonly referenced Df value is approximately 0.0037 at 10 GHz.
Typical applications include RF circuits, microwave systems, antennas, radar, 5G communication equipment, and automotive RF electronics.
Many conventional PCB fabrication methods can be used, although process parameters still require control based on the specific stack-up and design.
Yes. Rogers/FR-4 hybrid multilayer PCBs are commonly used to balance high-frequency performance and manufacturing cost.
Yes. It is frequently used for controlled impedance RF and microwave circuits because of its relatively stable dielectric properties.