- Base Material: FR4/CEM3/CEM1/FR1/HighTG/LF/HF/High frequency/Al base/Cu base
- Max Board Size:1L 1800*800mm; 2L 1200*600mm; ≧4L 1200*600mm
- Copper thickness: 1-12OZ
-Min line/space : 3/3mil
- Surface treatment: HASL, OSP, ENIG, Immersion Tin, Immersion Ag, Au plating
- Lead time: 1-3 days trial order, 5-7 days for normal order
- Shipment: DHL/Fedex/UPS/TNT/EMS/AIR/SEA ect,Follow customers requirements
- SMD SMT DIP Component Assembly
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