Circuit board three anti-paint due to different characteristics, the products also have their own characteristics, the operation process is naturally becoming more and more diversified, but the change

is inseparable, there are always some common points worth everyone’s attention. Then what should be noted when coating the FPC circuit board:

1. Clean and dry the board to remove moisture and moisture. The dust, moisture and oil on the surface of the object to be painted must be removed first so that it can give full play to its protective

effectiveness. Thorough cleaning ensures that corrosive residues are completely removed and that the tri-resistant paint adheres well to the board surface. Drying conditions: 60°C, 10-20 minutes,

after taking out in the oven while hot coating effect is better.

2. When brushing the three anti-paint, the brushing area should be larger than the area occupied by the device to ensure full coverage of the device and pad.

3. when brushing the circuit board as flat as possible, there should be no dettol after brushing, brushing should be smooth, there should be no exposed part, 0.1-0.3mm between the appropriate.

4. Before brushing and spraying the three anti-paint, ensure that the diluted three anti-paint is fully stirred, and place it for 2 hours before brushing or spraying. Use a high quality natural fiber brush

and brush gently at room temperature. If using machinery, the viscosity of the paint should be measured (with a viscosifier or flow cup), and the viscosity can be adjusted using a thinner.

5. the circuit board components should be vertically immersed in the paint tank. The connector should not be immersed, unless carefully covered, the circuit board should be immersed for 1 minute

until the bubble disappears, and then slowly taken out. A uniform film layer is formed on the surface of the circuit board. Most of the paint residue should be allowed to flow from the board back to

the impregnator. TFCF has different coating requirements. The immersion speed of the circuit board or components should not be too fast to avoid excessive bubbles.

6. When used again after dipping, if there is crust on the surface, remove the skin and continue to use.

7. Place the circuit board flat on the support after brushing.