First, it is well known that the practical fpc board wiring density is relatively high, but its light weight and good bending resistance, in the offline use of mobile phones and tablets or notebooks are

the use of high-quality fpc version, it can be compatible with thin and light electronic products, in order to ensure the overall quality of the fpc version, the core layer of this type of circuit board is an

ultra-thin polymer film, In the production of fpc board, the first step is to cut the polymer film uniformly, and then use laminate to isolate it.

Second, in order to make the fpc board bonded into an organic whole, it is necessary to send it into the vacuum pump box to make the layers closely bonded, in general, after a high temperature and

high pressure box processing for several hours, and at this time, the polymer film of the middle layer of the fpc board is coated with heat activated adhesive, so that it can easily achieve the purpose of

combining the fpc board substrate.

Third, if you want to ensure the processing quality of a more stable fpc board is far more than that, after the stacking plate, it is necessary to scientifically cut and cut into a fixed size layout, and the

use of high-tech equipment for drilling, for the later assembly preparation, through the film machine on the surface of the circuit board sticky on the fourth layer of sensitive layer film, The

processing of fpc board must be based on the needs of users with computer to draw integrated circuit diagram.

The key step of the fpc board is to put the board into the exposure machine, the use of fully automated equipment and computer for sensitive laser scanning of the controller, and then the surface of

the sensitive layer irradiated by the device will gradually increase the hardness, the reason why the fpc board is strong in pickling resistance after it is made, it benefits from this step. After

completing the above several matters, it is necessary to optimize the fpc version to ensure its overall processing quality