Circuit board resin plug process includes drilling, plating, plugging, baking, grinding, drilling the hole plating through, then  plug resin baking, and finally grinding it flat, ground the resin because it

does not contain copper, so there is another layer of  copper to turn it into PAD, these processes are done before the original PCB drilling process. That is, the holes of the fortress holes are processed

first, and then the other holes are drilled, according to the original normal process.

If the circuit board plug hole is not plugged, when there are bubbles in the hole, because the bubbles are easy to absorb moisture, the PCB board of the circuit board may explode when the tin

furnace, but if there are bubbles in the hole during the process of the plug hole, the bubbles will be extruded of the resin during baking, resulting in a concave side and a prominent  situation, at this

time, the defective products can be detected, and the circuit board with bubbles will not explode. Because the  main cause of the explosion is moisture, if the board or the board has been baked on the

piece, it will not cause the explosion in  general. The above is the pcb circuit board expedited welding for you to share the content.