Equipped with advanced circuit LDI direct imaging exposure machines and vacuum etching systems to ensure superior precision and efficiency.

In the industry, only few manufacturers but we have invested in LDI direct imaging and fully automated vacuum etching processes. This enables tighter control of line width and spacing within +/-5%, compared to the +/-20% of traditional exposure methods. It also ensures improved alignment accuracy and more precise PAD dimensions.
The automated line eliminates manual operations, reducing scratches, impact damage, and human errors. This results in faster mass production speeds, higher product consistency, and enhanced quality stability.

Equipped with a solder mask LDI direct imaging exposure line to achieve unparalleled alignment precision.

In the industry, only few manufacturers but we have invested in automated LDI for solder mask imaging. This technology utilizes fiducial marks for laser direct exposure on every board, ensuring superior registration control. The alignment between solder mask openings and PADS is precisely controlled within 25μm, a significant improvement over the 60μm of traditional exposure methods.
This innovation eliminates the chronic SMT concern of excessive solder mask misalignment in BGA areas, preventing the issue of the mask partially covering the PADS. The automated line requires no manual handling, effectively reducing scratches, impact damage, and human operational errors.

Equipped with an automated online inkjet printing line for legend to ensure impeccable marking precision.

In the industry, only few manufacturers but we have implemented fully automated inkjet systems for legend printing. This technology utilizes fiducial marks for precise positioning on every board, guaranteeing superior registration control. The alignment between legend printing and PADS is accurately controlled within 25μm, a dramatic improvement over the 75μm of traditional silk screening.
This advancement eliminates the long-standing SMT concern of severe legend misalignment, preventing the issue of ink partially covering PADS and ensuring optimal solderability. The automated line requires no manual handling, effectively reducing scratches, impact damage, and human operational errors.

Equipped with in-house lamination, HASL, and ENIG surface finishing lines to ensure full control over quality and lead time.

In the industry, many manufacturers outsource these critical processes, but our integrated facility allows us to eliminate the impact of industry peak and trough seasons, guaranteeing more stable deliveries. This enables more reliable rapid prototyping and faster mass production speeds.
By bringing these processes in-house, we effectively reduce the scratches, impact damage, and communication errors that often occur during external transportation and handling. This results in superior quality control, enhanced product consistency, and higher process stability.

Equipped with extensive automated production lines to ensure superior manufacturing efficiency and product quality.

In the industry, our significant investment in automation technology sets us apart. The interconnected machinery requires no manual operation, effectively reducing scratches, impact damage, and human operational errors.
This results in faster mass production speeds, exceptional product consistency, and higher quality stability. Overall, these comprehensive advantages effectively lower total costs and provide a stronger competitive edge for our customers.

Top level PcB material, from the source to ensure the quality ofPCB

PCB board: SY, KB, ILM, EMC, ITEQ, Arlon, Nelco etc.:PCB solution :Rohm&Haas(US)，Atotech(Germany) Umicore(Germany);PCB ink: Taiyo (apan) Dry Film :Asahi (Japan), Dupont(US);

Leading PCB process capability

The maximum number of PCB layers is 14 layers. The maximum PCB plate thickness is 5.0mm
The maximum copper thickness of PCB is up to 6OZ
The maximum working board size of PCB board is 1200x610mm and the thinnest 4-layer circuit board is 0.4mm