With the rapid development of science and technology, electronic products have also been rapid development, products also tend to high-end, line width line distance is getting smaller and smaller,

especially some IC feet, so that some traditional processes can not meet, at this time some boards need to use gold plating process, then double-sided pcb circuit board production process under

what circumstances to use gold plating surface treatment?

In the following cases, please consider settling gold

1. the line width of the board/pad spacing is insufficient, this situation is often difficult to use tin spray process production, there are more short circuit such as tin bridge, so in order to the

performance of the board is usually used in the process of sinking gold, basically will not appear in this situation.

2. the board has gold fingers need to be gold-plated, but the layout other than gold fingers can be selected according to the situation, such as spray tin or gold plating process, that is, the usual “gold

plating + gold plating finger” process and “spray tin + gold plating finger” process, occasionally a few designers in order to save costs or time to choose the full plate gold plating method to achieve

the purpose, but the gold plating can not reach the thickness of gold plating. A poor connection can occur if the goldfinger is inserted and peeled too often.

3. gold or gold plating because the surface of the pad has a layer of gold, so the weldability is good, the board performance is also stable.

Other circuit boards can save costs without choosing the gold plating process, of course, you have requirements for the weldability and electrical properties of the board.

The disadvantage is that settling gold is more expensive than conventional tin-spraying, and it is usually more expensive if the gold thickness exceeds the mill standard. Gold plating is more

expensive, but it works well. There are no problems with welding.