High precision eight-layer pcb circuit board processing process:

Eight-layer copper clad plate cutting a reference hole a CNC drilling through hole a test, deburring a brush a chemical plating (through hole metallization) a full plate electroplating thin copper a test

brush a screen printing negative circuit graphics, curing (dry film or wet film, exposure, development) a test, repair a line graphics electroplating a tin (corrosion resistance nickel/gold) a removal of

printing material (photosensitive film) a etched copper a tin removal a clear Clean and wash a screen print solder resistance graphics (paste photosensitive dry film or wet film

exposure,development, heat curing, commonly used photosensitive heat curing green oil) ~ cleaning, drying a screen print marking character graphics, curing a shape processing, cleaning, drying a

electrical continuity detection a spray tin or organic welding film a inspection package a finished product factory.

In terms of the process, high-precision eight-layer pcb board: the printed board with a good pattern has been made: upper board → acid oil removal → scanning water → secondary countercurrent

water → micro-corrosion → scanning water → secondary countercurrent water → copper plating prepreg → copper plating → Scanning water → tin plating prepreg → tin plating → secondary

countercurrent water → lower board. More than eight layers are divided into holes and blind holes, the holes are opened from the top to the bottom, and the blind holes are only visible in the top or

bottom of one of the layers, the other layer is not visible, that is to say, the blind holes are drilled from the surface, but do not drill through all layers. There is also a kind of buried hole, buried hole

refers to the inner layer through the hole, the bottom of the table can not be seen. The advantage of making buried and blind holes is that you can increase the wiring space.

Eight-layer pcb wiring method: In general, eight-layer pcb boards can be divided into the top layer, the bottom layer and two intermediate layers. The top layer and the bottom layer take the signal

line, and the middle layer first uses the command DESIGN/LAYERSTACKMANAGER to add INTERNALPLANE1 and INTERNALPLANE2 as the most used power layer such as VCC and the ground

such as GND (that is, connect the corresponding network label).

Be careful not to use ADDLAYER, this will increase the MIDPLAYER, the latter is mainly used for multi-layer signal line placement), In this way, PLNNE1 and PLANE2 are two layers of copper

sheets connecting the power supply VCC and the ground GND.