1. the problem of substrate processing: especially for some thinner substrates (generally below 0.8mm), because the substrate rigidity is poor, it is not suitable to brush the board. This may not be

able to effectively remove the substrate production process to prevent the copper foil oxidation and special treatment of the protective layer, although the layer is thin, brush board is easier to

remove, but the use of chemical treatment is more difficult, so in the production and processing of important attention to control, so as not to cause the substrate copper foil and chemical copper

poor bonding force caused by the foaming of the board; When this problem is blackened in the thin inner layer, there will also be poor blackening and Browning, uneven color, and poor local

blackening and Browning.

2. the surface in the machining (drilling, laminating, milling, etc.) process caused by oil or other liquids contaminated with dust pollution surface treatment is poor.

3. the copper brush plate is bad: the grinding plate pressure is too large before the copper sedimentation, resulting in the deformation of the orifice and the brush out of the orifice copper foil and

even the orifice leakage of the substrate, so that the orifice foaming phenomenon will be caused in the process of copper plating and tin-spraying welding; Even if the brush plate does not cause

leakage of the substrate, the heavy brush plate will increase the roughness of the copper at the orifice, so the copper foil there is easy to produce excessive coarsening phenomenon in the process of

micro-etching and coarsening, and there will be certain hidden dangers in quality; Therefore, it is necessary to pay attention to strengthen the control of the brush process, and the brush process

parameters can be adjusted to the best through the wear mark test and the water film test.

4. washing problems: Because copper plating treatment to go through a large number of chemical potion treatment, all kinds of acid and alkali and organic drug solvents more, the board washing is

not clean, especially copper adjustment degreasing agent, not only will cause cross pollution, but also cause the local treatment of the board poor or poor treatment effect, uneven defects, resulting in

some binding force problems; Therefore, we should pay attention to strengthen the control of washing, mainly including the control of the flow rate of cleaning water, water quality, washing time,

and the drip time of the board; Especially in winter when the temperature is low, the washing effect will be greatly reduced, and more attention should be paid to the control of washing;