Due to various reasons, the circuit board using OSP surface treatment process may have expired use. Here we will deal with it in several cases:

1.  When PCB leaves the factory from the circuit board factory, the general packaging method is to pump the vibration hole, put the desiccant and humidity card. If the storage environment is good

and the humidity card does not exceed the standard, you can first do the tin dip verification, and you can also use it directly if there is no problem. However, if for production risk control

considerations, it is necessary to bake;

2. Expired two or three months of OSP PCB if the storage environment is good, it can also be used without baking, directly after eating tin verification;

3. If there is baking equipment, you can bake at low temperature, and then do the tin test;

4. If there is no baking equipment, you can try the furnace welding, the effect is similar;

5. If it is a board that has been saved for two or three years, we do not recommend using it again, because the probability of problems is too large, it is recommended to make a new batch.

In fact, OSP PCB is not recommended to bake, if the high temperature barbecue will destroy the chemical coating on the PCB surface and cause oxidation of the pad. The only thing that needs to be

baked is that the PCB has been stored for too long, and there will be water vapor inside, which needs to be baked at low temperature, and the temperature does not exceed 100 degrees to reduce the

damage to the OSP layer.

The PCB board to damp is actually a small matter, the only biggest problem is the occurrence of oxidation, or oxidation is not particularly obvious, the most troublesome thing is that the solder is not good.