- Base Material: FR4/CEM3/CEM1/FR1/HighTG/LF/HF/High frequency/Al base/Cu base
- Max Board Size:1L 1800*800mm;2L 1200*600mm;≧4L 1200*600mm
- Copper thickness：1-12OZ
- PCB Layers: 1-20 Layers
- Min line / space: 3/3mil
- Surface treatment:HASL,OSP,ENIG,Immersion Tin,Immersion Ag,Au plating
- Lead time: 1-3 days trial order,5-7 days for normal order
- Shipment:DHL/Fedex/UPS/TNT/EMS/AIR/SEA ect,Follow customers requirements
- SMD SMT DIP Component Assembly
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