In the PCB electroplating process, the main salt refers to the salt that can deposit the required coating metal on the cathode in the plating solution, which is used to provide metal ions. The main salt

concentration in the bath must be in an appropriate range, and the main salt concentration increases.  In some cases, if the metal ions of the main salt in the plating solution are simple ions, the

plating grains are coarse, so the plating solution of complex ions should be used. The method of obtaining  complex ions is to add a complex agent, that is, a substance that can complex metal ions of

the main salt to form a complex. A complex is a “molecular compound” formed by the interaction of simple  compounds. In a bath containing complexes, the effect of electroplating is mainly affected

by the relative content of the main salt and the complexing agent, that is, the free amount of the complexing agent, rather than the absolute content.

Buffers are substances used to stabilize the pH of a solution. This kind of substance is generally composed of weak acid and weak acid salt or weak base and weak base salt, so that when the solution

encounters alkali or acid, the pH value of the solution is reduced.  Additives are substances that do not significantly change the electrical conductivity of the coating, but can significantly improve the

performance of the coating. According to the role played in the plating solution, additives can be divided into: brightener, leveling agent, and fogging agent.

The substance that can promote anode activation in the plating solution is called anode activator. The role of anode activator is to increase the current density at which the anode begins passivation,

so as to ensure that the anode is in an active state and can dissolve normally. When the anode activator content is insufficient, the anode dissolution is not normal, and the main salt content

decreases rapidly, which affects the stability of the plating solution. In severe cases, plating can not be carried out normally.

Factors affecting plating quality：

Electroplating can be electroplated with different metals, zinc plating, nickel plating, chromium plating, etc.

PH value, additives, current density, current waveform, temperature, stirring speed, etc