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Principles of PCB board design layout based on PROTEL DXP software
2025-02-07

Principles of PCB Board Design Layout Based on PROTEL DXP Software

1. Introduction to PROTEL DXP for PCB Design

PROTEL DXP (now known as Altium Designer) is one of the most widely used PCB design software tools, providing engineers with a powerful platform for schematic design, PCB layout, and circuit simulation. It offers advanced features such as multi-layer PCB design, autorouting, and signal integrity analysis, making it ideal for professional electronics development.

This article explores the key principles of PCB board design layout using PROTEL DXP, covering component placement, routing strategies, power distribution, ground plane optimization, and design rule checks (DRC).

PCB Board Design Layout Based on PROTEL DXP Software

PCB Board Design Layout Based on PROTEL DXP Software


2. Key Considerations for PCB Design in PROTEL DXP

Before starting the PCB layout, it is crucial to consider:

Circuit Complexity – Determine if the design requires single-layer, double-layer, or multi-layer PCB.
Component Selection & Placement – Ensure proper spacing for heat dissipation and signal integrity.
Power Distribution & Grounding – Minimize noise and improve stability.
Design Rules & Constraints – Define clearance, track width, and via size based on manufacturing requirements.
Signal Integrity & EMI Control – Reduce interference and optimize high-speed signal paths.


3. Step-by-Step PCB Layout Process in PROTEL DXP

3.1 Importing the Schematic

The first step in PROTEL DXP PCB design is importing the schematic diagram into the PCB layout editor. This is done using the “Design > Import Changes from Schematic” function, which synchronizes the PCB design with the schematic.

Key Actions:

  • Verify netlist connections to ensure all signals are correctly mapped.
  • Check for missing components or design rule violations.
  • Organize the PCB layer stackup based on design requirements.

3.2 Component Placement Principles

Proper component placement is critical for PCB performance, manufacturability, and thermal management.

🔹 Group Related Components: Place components according to functional blocks (e.g., power supply, microcontroller, analog, and digital sections).
🔹 Minimize Signal Path Length: Reduce the length of high-speed signals to minimize parasitic inductance and capacitance.
🔹 Align Components for Routing Efficiency: Arrange components to ensure clean and efficient routing.
🔹 Avoid Heat Accumulation: Place high-power components near edges or use thermal vias to dissipate heat.
🔹 Respect Manufacturing Constraints: Follow PCB design for manufacturability (DFM) guidelines to ensure smooth production.


3.3 PCB Routing Strategies

Once components are placed, the next step is to route the PCB traces efficiently.

3.3.1 Signal Routing Best Practices

Use Short and Direct Traces: Minimize trace lengths to reduce resistance and signal delay.
Maintain Proper Trace Widths: Follow current-carrying capacity guidelines to prevent overheating.
Separate Analog and Digital Traces: Avoid interference by keeping analog and digital signals apart.
Use Differential Pairs for High-Speed Signals: Maintain consistent trace length and spacing for signals like USB, HDMI, or LVDS.
Avoid Right-Angle Traces: Use 45-degree bends to reduce EMI and improve signal integrity.

3.3.2 Power and Ground Routing

Use Thick Power Traces: Ensure power traces are wide enough to carry the required current.
Implement a Solid Ground Plane: A dedicated ground plane reduces noise and improves signal return paths.
Minimize Ground Loops: Keep ground return paths short to avoid EMI problems.
Use Decoupling Capacitors: Place capacitors near IC power pins to filter noise and stabilize voltage.


3.4 Via Design and Layer Management

Vias are essential for connecting different PCB layers and ensuring electrical continuity.

Use Different Via Types:

  • Through-hole vias – Standard connection between all layers.
  • Blind vias – Connect outer layers to inner layers.
  • Buried vias – Connect inner layers without affecting external layers.

Minimize Via Count: Excessive vias increase parasitic capacitance and inductance.
Optimize Via Placement: Keep vias away from high-speed signals to reduce reflections.


3.5 PCB Power Integrity and EMI Control

Effective power integrity (PI) and electromagnetic interference (EMI) control are crucial for high-performance PCBs.

🔹 Use Power and Ground Planes: Solid copper planes provide stable voltage and reduce noise.
🔹 Shield High-Frequency Components: Place ground shields around high-speed signal paths.
🔹 Use Proper PCB Layer Stackup: Multi-layer PCBs help isolate signals and improve EMI performance.
🔹 Route Clock Signals Carefully: Avoid crossing clock traces with other signals to prevent interference.
🔹 Follow PCB Design Rule Checks (DRC): Run PROTEL DXP’s DRC tool to detect potential EMI issues.


4. Design Rule Check (DRC) and Final Verification

Before finalizing the PCB layout, it is essential to perform a Design Rule Check (DRC) to ensure compliance with manufacturing and electrical requirements.

Run the DRC Tool in PROTEL DXP: Identify clearance violations, trace width issues, and other errors.
Verify PCB Dimensions and Hole Sizes: Ensure proper PCB board outline, mounting holes, and via sizes.
Check for Unconnected Nets: Use PROTEL DXP’s Electrical Rules Check (ERC) to detect missing connections.
Generate Gerber Files: Convert the PCB design into Gerber format for manufacturing.
Perform Signal Integrity Analysis: Use PROTEL DXP’s signal integrity tools to verify high-speed signals.


5. Best Practices for PROTEL DXP PCB Design

To achieve a high-quality PCB layout, follow these best practices:

Plan the Design Before Layout: Carefully structure component placement and routing strategy.
Follow Industry Standards: Use IPC PCB design guidelines for reliability and manufacturability.
Keep High-Speed Signals Short: Avoid long traces for high-frequency signals to prevent interference.
Use Copper Pour for Grounding: Improve EMC performance by utilizing ground pours.
Optimize Thermal Management: Use heat sinks, thermal vias, and proper component spacing.


6. Conclusion: Why Use PROTEL DXP for PCB Design?

PROTEL DXP (Altium Designer) is a powerful PCB design software that allows engineers to create high-quality, professional PCB layouts with precision. By following the principles outlined in this article—effective component placement, optimized routing, power integrity management, and thorough design verification—PCB designers can maximize performance, reliability, and manufacturability.

For professional PCB design and manufacturing, Shenzhen Shuoqiang Electronics offers custom PCB solutions with advanced PROTEL DXP-based design capabilities, ensuring high-quality results for industrial, automotive, medical, and consumer electronics applications.

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