PROCESS AND EQUIPMENT
PCB Process
Picture
Technological Process

Multylayer

Double layer

equipment
step1

CAM

Optical scanner

Optical scanner

step2

Sheets Cutting

Sheets Cutting

Sheets Cutting

step3

Ink Coating

None

Ink Coating

Ink Coating

step4

Exposure

None

Exposure

Exposure

step5

DES

None

DES

DES

step6

AOI

None

Optical scanner

Optical scanner

step7

Brown
Oxidation

None

Brown Oxidation

Brown Oxidation

step8

Lamination

None

Lamination

Lamination

step9

Xray Drill
Target

None

Xray Drill Target

Xray Drill Target

step10

Drilling

Drilling

Drilling

step11

PTH

PTH

PTH

step12

Copper Plating

Copper Plating

Copper Plating

step13

Dry Film Lamination

Dry Film Lamination

Dry Film Lamination

step14

Exposure

Exposure

Exposure

step15

Developing

Developing

Developing

step16

Copper Plating

Copper Plating

Copper Plating

step17

Lead Plating

Lead Plating

Lead Plating

step18

SES

SES

SES

step19

AOI

AOI

AOI

step20

Solder Mask Printing

Solder Mask Printing

Solder Mask Printing

step21

Exposure

Exposure

Exposure

step22

Developing

Developing

Developing

step23

Legend Printing

Legend Printing

Legend Printing

step24

HASL/ENIG/OSP

HASL/ENIG/OSP

HASL/ENIG/OSP

step25

N/C Routing

N/C Routing

N/C Routing

step26

ET/Flying Probe Test

ET/Flying Probe Test

ET/Flying Probe Test

step27

FQC

FQC

FQC

step28

Packaging

Packaging

Packaging

step29

SMT

SMT

SMT

step30

SOLDER

SOLDER

SOLDER

Quote
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