Many customers believe that ENIG PCB is expensive because it uses a large amount of gold.
But is that really true?
In PCB manufacturing, the actual amount of gold used in an ENIG (Electroless Nickel Immersion Gold) surface finish is usually much less than most people expect.
The higher cost of ENIG PCB does not mainly come from gold material itself. The cost is related to the complete chemical process, including nickel plating, immersion gold deposition, chemical control, wastewater treatment, and quality management.
This article explains how much gold is actually used on a PCB and why ENIG remains a higher-cost surface finish compared with HASL or OSP.

How Much Gold Is Used in ENIG PCB
ENIG is a two-layer surface finish consisting of:
The nickel layer acts as a barrier between copper and gold, while the thin gold layer protects the nickel surface from oxidation and provides excellent solderability.
Typical ENIG thickness:
| Layer | Typical Thickness |
|---|---|
| Nickel | 3–7 μm |
| Gold | 0.03–0.08 μm |
The gold layer is extremely thin.
Unlike hard gold plating, ENIG does not deposit a thick gold layer for wear resistance.
To estimate gold consumption, we need several assumptions.
PCB area:
1 m²
Gold coverage ratio:
20%
(Most PCB surfaces are not completely covered with gold. Only exposed pads, fingers, and contact areas receive gold.)
Gold thickness:
Gold density:
19.32 g/cm³
Gold Weight =
PCB Area × Gold Coverage Ratio × Gold Thickness × Gold Density
PCB area:
1 m² = 10,000 cm²
Gold coverage:
20%
Effective gold area:
10,000 × 20%
= 2,000 cm²
Gold thickness:
0.0254 μm
= 0.00000254 cm
Calculation:
2,000 × 0.00000254 × 19.32
≈ 0.098 g gold
Therefore:
1m² PCB with 1U” ENIG uses approximately 0.1g gold
Gold thickness:
0.0508 μm
Calculation:
2,000 × 0.00000508 × 19.32
≈ 0.196 g gold
Therefore:
1m² PCB with 2U” ENIG uses approximately 0.2g gold
Assuming gold price:
917 RMB/g
(Example market price)
Gold weight:
0.098g
Gold material cost:
0.098 × 917
≈ 90 RMB
≈ USD 12–13
Gold weight:
0.196g
Gold material cost:
0.196 × 917
≈ 180 RMB
≈ USD 25
Many people are surprised by this result.
If only the gold material is considered, the cost is not extremely high from PCB supplier.
The real ENIG cost comes from the complete manufacturing process.
Major cost factors include:
Nickel deposition requires:
The gold layer is deposited through a controlled chemical replacement reaction.
Process stability affects:
ENIG requires various chemicals, including:
PCB chemical processes require strict environmental control.
Waste treatment and compliance management are also part of the manufacturing cost.
A common misunderstanding is:
Thicker gold always means better PCB performance.
This is not always true.
The correct gold thickness depends on the application.
For example:
Usually:
is sufficient.
May require:
The best surface finish is the one that matches the application requirement.
| Surface Finish | Relative Process Cost |
|---|---|
| OSP | 1 |
| HASL | ~5 |
| Gold Flash | 30+ |
| ENIG | 60 |
| Hard Gold | 60+ |
The above is a relative process cost index, not the total PCB price.
Actual cost depends on:

PCB Surface Finish Comparison: ENIG, HASL, OSP, Gold Flash, and Hard Gold
A 1m² ENIG PCB usually contains:
The reason ENIG is more expensive is not simply because it uses a lot of gold.
The real cost comes from:
Understanding the real cost structure helps engineers and purchasing teams choose the right PCB surface finish instead of simply selecting the most expensive option.
Typically around 0.1–0.2 grams of gold per square meter PCB, depending on gold thickness and exposed area.
Not mainly. The major cost comes from the complete ENIG chemical process and quality control.
No. Gold thickness should match the application requirements. Excessive gold thickness may increase cost without improving performance.
ENIG provides better flatness and is suitable for fine-pitch components such as BGA. HASL is more economical for many standard applications.